Fans Off, Power On: Cincon Conduction Cooling PSUs

by Jenny Olding | 23rd Sep 2026

Conquering severe thermal bottlenecks in sealed, fanless enclosures requires a shift from traditional airflow to Cincon”s advanced conduction cooling technology.

The Sealed Enclosure Challenge

      Designing for sealed, fanless enclosures means facing one ultimate enemy: heat. Without airflow, standard power supplies may eventually overheat and fail.

At Cincon, we solve this with industry-leading Conduction Cooling—transferring heat directly through the baseplate to the chassis, eliminating mechanical fans, noise, and dust ingress.

Choosing Your Shield: CFM vs. LFM Series

Whether you need a robust standard design or a high-density flagship, we have you covered:

• Select CFM Series: Our reliable, high-performance conduction-cooled foundation for diverse industrial applications.
• LFM Series (Flagship): Engineered for extreme space constraints and next-gen integration. It features:
  • Ultra-Thin 1-Inch Profile: Built for compact systems.
  • Semi-Potted Design: The potting compound acts as an active thermal bridge, transferring heat far more efficiently than open-frame competitors.
  • Liquid-Cooling Ready: Engineered with a 1-inch low profile, baseplate-cooling design, and semi-potted structure, the LFM series mates seamlessly with liquid cold plates to deliver unrivaled thermal performance.

Explore Our Conduction Portfolio: Cincon Fanless Power Solutions